Three-dimensional modeling and/or manufacturing apparatus, and related processes

ABSTRACT

A uniquely featured addition to previous three dimensional prototyping machinery without any traversing X and Y coordinate moving parts, thus saving time by focusing on only an incrementally regular Z stage and the rapidity of chemical deposition via electrically localized reaction nodes through a porous/channeled plane called the build/extrusion platen. Processes for making objects using such machine and platen are also disclosed as well as features and further indexing of extrusion location inventions. Other features including chemistry, curing material, and curing control as well as activation methods and machines are also disclosed in combination with the feature of a simultaneous two-dimensional layer-wise deposition machine and process for “growing” the object in the Z direction using the displaceable platen or object supporting stage in a rapid manner. Further due to the rapid growth and deposition manner, additional benefits to the object creation and curable material, e.g. a monomer can be realized.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/877,797 filed Oct. 7, 2015, which claims the benefit of, and priorityto, U.S. Provisional Patent Application 62/061,024 filed Oct. 7, 2014.The contents of both of these applications are hereby incorporated byreference herein.

Previous patent filings by the inventor Milton Meisner as discussedherein include U.S. Patent Publication 2009/0051863 A1 “DisplaysIncluding Addressable Trace Structures,” U.S. Pat. No. 7,427,201“Resonant Frequency Filtered Arrays for Discrete Addressing of aMatrix,” and International Publication WO 2008/151063 “High DefinitionVersatile Stereolithic Method and Material,” the contents of all threedocuments and related files are hereby incorporated herein by referencein their entirety.

BACKGROUND

The field of the Invention includes computer-controlledthree-dimensional (“3D”) object formation via deposition of materials tocreate objects. Most viable means of 3D object formation are effectedvia computer aided design, employing a machine and materials developedfor this purpose.

Generally called “Three-dimensional printing,” and “3D Printing,” thisprocess has also been referred to as “Stereolithography,” “RapidPrototyping,” and “Additive Manufacturing,” among other names, usuallydepending upon the chosen method.

3D object building can be generally defined as the serial, layer-wisedeposition and stacking of sequential cross-sections of an object. Themethods available are varied and include sintered powder layers affixedby lasers or sprayed adhesive, ink jet droplets of monomersUV/photo-curing in situ, extruded plastic filament heated to melting,deposited and then cooled to reform as a solid, and more. In addition tothe additive methods, subtractive methods are employed, referring to thecomputer-controlled removal of material for shaping of layers. All theaforementioned are included the field of this invention. Following thisintroduction is a further discussion and list of methods and comparisonsbetween them.

Three-dimensional “3D” Printing, also known as “Additive Manufacturing,”is a relatively new field of science wherein objects are built viaComputer Aided Modeling, triggering the controlled layer-wise depositionof curable or harden-able/catalyzed materials using various processes,to build a three-dimensional object.

In general, additive processes are used, wherein successive layers ofbuild material are deposited and stacked according to the requisitegeometry of each cross-section layer of the object being built. Theseobjects can be of almost any shape or geometry, and are produced from a3D model or other electronic data source. The building occurs wherein atracing of x/y planes is effected via mechanical movement similar tothat of a print head over paper in a printer. Instead of depositing ink,the head is depositing an adhesive, a thermoplastic, or other buildablematerial; or the tracing mechanism may be delivering a catalyst such ascurative laser beam scanning through a pool of photopolymer liquid.Instead of feeding sequential pages as in a two-dimensional printer, thebuild area, or the area where commonly a stack of paper would be found,would move downwards on a z-axis (vertically) to accommodate the nextsubsequent layer, or instead the print head holding-mechanism will moveupwards on the z-axis after the completion a subsequent layer, atop theprevious one, after it has been completed.

There is a plurality of processes that sequentially deposit material.Moreover, recently the meaning of the term has expanded to encompass awider variety of techniques, such as ink jet-, extrusion-, andsintering-based processes. Generally, the terms “Additive Manufacturing”and “3D Printing” are interchangeable parlance for any method of 3Dobject creation, generally via computer aided design. In addition, it iscommonly called, “Rapid Prototyping” (RP).

Early Additive Manufacturing, (abbreviated as “AM”), equipment andmaterials were first developed in the 1980's. For example in 1981, HideoKodama of Nagoya Municipal Industrial Research Institute invented two AMfabrication methods of a three-dimensional plastic model withphoto-hardening polymer, wherein the UV-exposure area is controlled by amask pattern, or the scanning fiber transmitter.

Then in 1984, Charles Hull of 3D Systems Corporation developed aprototype system based on this process known as “Stereolithography,” inwhich layers are added by curing photopolymers with ultraviolet lightlasers. Hull defined the process as a, “system for generatingthree-dimensional objects by creating a cross-sectional pattern of theobject to be formed,” but this had been already invented by Kodama.Hull's important contribution to 3D printing is the design of the STL(STereoLithography) 3D printing software file format widely accepted bymost users, as well as the digital slicing and infill strategies commonto many processes today.

The term “3D Printing” originally referred to a process employingcustomized inkjet print heads to deliver materials for building objects.

The technology used by most 3D printers to date—especially hobbyist andconsumer-oriented models—is fused deposition modeling (FDM), aspecialized micro-application of thermoplastic extrusion.

Any AM process for metal sintering or melting, (such as selective lasersintering, direct metal laser sintering, and selective laser melting),was generally referred to by its specific nomenclature in the 1980's and1990's. Nearly all metalworking production at the time was by casting,fabrication, stamping, and machining; even though automation wasfrequently applied to those technologies, (such as by robot welding andCNC), the idea of a tool or head moving through a 3D work-envelopetransforming a mass of raw material into a desired shape layer by layer,was associated by most people only with processes that removed metal,(Subtractive), rather than adding it, such as CNC milling, CNC EDM, andothers.

By the mid-1990's, new techniques for serial layer-wise materialdeposition were developed at Stanford University and Carnegie MellonUniversity, including Micro-casting and sprayed materials.

Sacrificial parts, sprues, and support materials had also become morecommon, enabling the printing of new object geometries with negativespace or delicate freestanding parts. Additive AM-type sintering wasbeginning to take hold as a viable means of metal object creation.

The umbrella term “Additive Manufacturing” gained wider exposure in thedecade of the 2000's, as the various additive processes began to mature.With regard to metal, it became clear that soon metal removal would nolonger be the only metalworking process done under that type of control.It was during this decade that the term “Subtractive Manufacturing”appeared as a retronym for the large family of machining processes withmetal removal as their common theme.

During that time, the term “3D Printing” still generally referred onlyto the polymer technologies most popular; the term AM was more generallyused in metalworking contexts than amongpolymer/inkjet/Stereolithography enthusiasts. The term “Subtractive” hasnot replaced the term “machining,” instead complementing it when aterminology that covers any removal method is needed.

By the early 2010's, the terms “3D Printing” and “AdditiveManufacturing” became overarching descriptors for all AM technologies.Although this was a departure from the earlier technically narrowernomenclatures, the generalization of the term reflects the simple factthat all the technologies employed to build objects share a commonality:The sequential layer-wise deposition of material, adjoining thesesuccessive layers throughout a 3D work envelope, under automatedcontrol.

Other vernacular terminologies have evolved, which are commonly used asAM synonyms, such as “Desktop Manufacturing (DM),” “Rapid Prototyping(RP),” also common vernacular, “Rapid Manufacturing (RM),” implying theindustrial production-level successor to RP, and “On-DemandManufacturing (ODM),” “Maker,” “Solid,” and other terms also joined thevocabulary set for the new art of 3D object creation.

The 2010's were the first decade in which metal parts such as enginebrackets and large bolts and nuts would be built, (also referred to as“grown”), in job production, rather than having to be machined from barstock or plate metal.

Current technological advances in 3D printing have grown to include theprinting of biological materials, medical devices, dental implants andaccessories, and even surgically implantable tissue-based materials.

General Principles

Understanding how the process works requires first that there be anobject to print in a format that is translatable to mechanicalreplication. Thus, first the object to be printed has to be eitherscanned or created via three-dimensional rendering software. 3Dprintable models may be created with a computer aided design package, orvia a 3D scanner, or via a plain, digital camera, and photogrammetrysoftware. The manual modeling process of preparing geometric data for 3Dcomputer graphics is similar to other plastic parts such as mold makingand sculpting. 3D scanning is a process of analysis and collection oftopographical, digital data of the surface shape and appearance of areal object. Based on this data, three-dimensional models of the scannedobject can then be produced.

Regardless of the 3D modeling software used, the 3D model, (often in.skp, .dae, .3ds or some other format), then needs to be converted toeither an .STL or an .OBJ format, to allow the printing software to beable to read it and deposit layers according to the desired buildmaterial, desired tolerances and other aspects.

With current technologies, before printing a 3D model from an STL file,the object file must first be examined for “manifold errors,” this stepbeing called the “fixup.” .STL files that have been produced from amodel obtained through 3D scanning are particularly vulnerable to manymanifold errors that must be adjusted manually in the file beforeconversion of the file for printing. Examples of these manifold errorsare surfaces that do not connect, or gaps in the models' surface.

Once adjusted, the .STL file needs to be processed by a software stagecalled a “slicer,” which converts the model into a series of thinlayers. The layers are generated at the thickness appropriate for thepredetermined build material and desired resolution. This produces a“G-code file” containing instructions tailored to a specific type of 3Dprinter. G-Code is a software language that sends discrete pulses to anelectric motor, and thereby allows the user to control machine movement.In 3D printing, it instructs mechanical movement in the machine duringthe 3D printing process.

Printer resolution describes layer thickness and x/y resolution indots-per-inch (DPI) or micrometers (μm). Typical layer thickness isaround 100 μm (250 DPI)), although some machines can print layers asthin as 16 μm (1,600 DPI)). The x/y resolution is comparable to that oflaser printers. The particles created are volumetric pixels, which hasgenerated the term “Voxels,” (3D dots), and are generally around 50 to100 μm, (510 to 250 DPI, or “Voxels Per Inch”—“VPI”), in diameter, theterm “VPI” implying that the dimensions would be cubic.

Construction of an object with contemporary methods can take anywherefrom several hours to several days, depending on the method used and thesize and complexity of the model. This is a long period of time, evenfor the fastest methods, for the art to be adopted into serialready-for-sale object manufacturing. Some additive systems can typicallyreduce this time to a few hours, although it varies widely, depending onthe type of machine used and the size and number of models beingproduced simultaneously.

Errors often occur in the mechanical stage of the object building. Theseare caused by the print head, which moves along an x/y axis to at timesinaccurately deposit material, or from the x, y, or z-axis, the verticalaxis of the build surface, to be mechanically moved incorrectly tocreate mistakes in the object. This mechanical movement is problematicfor many kinds of 3D printing.

Traditional techniques, such as injection molding can be less expensivefor manufacturing polymer products in high volume quantities, butAdditive Manufacturing can be faster, more flexible and less expensivewhen producing relatively small quantities of parts or custom parts.However, in general it is not fast enough to replace injection molding.

3D printers give designers and concept development teams the ability toproduce parts and concept models, often using a desktop-sized printer ora convenient outside Service Bureau, wherein one may find several kindsof 3D printers, and one may choose the material and method suitable toone's needs, both material and budgetary. The cost of the printedprototype, cost and choice of materials, and color capabilities all aredecision influencers.

The problem of distortion of built objects has been dealt with inseveral ways, for example, though the printer-produced resolution issufficient for many applications, printing a slightly oversized versionof the desired object in standard resolution and then removing materialwith a higher-resolution subtractive process can achieve greaterprecision, particularly because some distortion of the built object canoccur when the materials are fully polymerized or temperature stabilizedenough for final dimensional rendering.

Some printable polymers allow the surface finish to be smoothed andimproved using chemical vapor processes.

Some additive manufacturing techniques are capable of using multiplematerials in the course of constructing parts. These techniques are ableto print in multiple colors and color combinations simultaneously, andwould not necessarily require painting.

Some printing techniques require internal supports to be built foroverhanging features during construction. These supports must bemechanically removed or dissolved upon completion of the build.

In metal printing, 3D printing allows substrate surface modifications toremove aluminum or steel.

Example Processes and Machines

Many different 3D printing processes have been invented since the late1970's. The printers were originally large, expensive, and highlylimited in what they could produce.

A large number of additive processes are now available. The maindifferences between processes are in the way layers are deposited tocreate parts, and in the materials that are used.

Some methods melt or soften material to produce the layers, e.g.selective laser melting (SLM) or direct metal laser sintering (DMLS),selective laser sintering (SLS), fused deposition modeling (FDM), orfused filament fabrication (FFF), while others cure liquid materialsusing different sophisticated technologies, e.g. Stereolithography(SLA). With laminated object manufacturing (LOM), thin layers are cut toshape and joined together (e.g. paper, polymer, metal). Each method hasits own advantages and drawbacks.

Printers that work directly with metals are expensive. In some cases,however, less expensive printers can be used to make a mold, which isthen used to make metal parts.

There are presently many existing types of three-dimensional prototypingmachines that are controlled by computers. Usually a software-aideddesign platform sends commands to a machine in the form of subdividedtwo-dimensional frames of material deposition or subtraction, whichinvolves stepper motor movements and/or material nozzle deposition doneeither by extrusion, jetting as in an inkjet type of precision droplets,or an actinic beam such as an ultraviolet or electron beam scannedmechanically over a sequentially stepped volume of uncatalyzed monomer.Powder sintering from additive layers is also a popular method whereinsequential layers of powder are sintered by jetted liquids or by heatfrom a scanning laser. Each of the present three dimensional prototypingtypes of machines have various advantages for various markets but theyhave inertial speed limitations due to the mechanical carriageassemblies which are involved in the material deposition or subtractionprocess. This new machine design, apparatus and method will be able togreatly and even exponentially surpass the present speeds of threedimensional prototyping machines, largely by eliminating the mechanicalapparatus most responsible for taking the most time depositing orsubtracting sequential layers of object material.

Key problems with conventional methods and designs include: slowness ofbuild, mechanically complex machines, limited materials, limitedmaterial selection, weak or brittle materials, requirement forafter-processing, distortion, lack of photorealistic color, cumbersomemechanical housings, complicated electronics, expensive, notuser-friendly, and most significantly, not cost effective enough, fastenough, or accurate enough for industrial ready-for-sale manufacturing.

Examples of extrusion methods include and fused Deposition Modeling(FDM), Fused Filament Fabrication (FFF). These generally usethermoplastics, eutectic metals, edible materials, rubbers, modelingclay, metal clay (including precious metal clay), wherein filament ormaterial is fed through a melting head, which then deposits moltenplastic and it hardens as it cures.

Robocasting or Direct Ink Writing (DIW). These generally use ceramicmaterials, Metal alloy, cermet, metal-matrix composite, ceramic matrixcomposite.

Light Polymerized: Stereolithography (SLA) photopolymer, and DigitalLight Processing (DLP) photopolymer.

Photopolymers are cured using a laser UV light source, which traces theobject on the x/y place and the stacks layer in a z direction drop thepreviously cured layer.

Powder Bed includes the powder bed and inkjet head 3D printing (3DP).This can use almost any metal alloy, powdered polymers, and plaster, forexample.

Electron-beam melting (EBM) can use almost any metal alloy includingTitanium alloys.

Selective laser melting (SLM) can use titanium alloys, cobalt chromealloys, stainless steel, and aluminum.

Selective Heat Sintering (SHS) can use thermoplastic powder.

Selective Laser Sintering (SLS) can use thermoplastics, metal powders,ceramic powders, photopolymers.

Direct metal laser sintering (DMLS) can use many metal alloys, but wemust differentiate DMLS from EBM (electron beam melting), which requiresa vacuum and avoids most severe oxidation effects. DMLS has manyexceptions for metals because of oxidation problems.

Laminated includes laminated object manufacturing (LOM) using paper,metal foil, plastic film.

Electron Beam Freeform Fabrication (EBF3) can use almost any metal alloy

Extrusion Deposition

Fused deposition modeling (FDM) was developed by S. Scott Crump in thelate 1980's and was commercialized in 1990 by Stratasys. After thepatent on this technology expired, a large open-source developmentcommunity developed and both commercial and DIY variants utilizing thistype of 3D printer appeared. As a result, the price of this technologyhas dropped by two orders of magnitude since its creation.

In fused deposition modeling, the model or part is produced by extrudingsmall beads of material, which harden immediately to form layers. Athermoplastic filament or metal wire that is wound on a coil is unreeledto supply material to an extrusion nozzle head, (3D printer extruder).The nozzle head heats the material and turns the flow on and off.Typically stepper motors or servo motors are employed to move theextrusion head and adjust the flow. The printer usually has three axesof motion (x/y/z). A computer-aided manufacturing (CAM) software packageis used to generate the G-Code that is sent to a micro-controller, whichcontrols the motors. Extrusion in 3D printing using material extrusioninvolves a cold end and a hot end.

Various polymers are used, including acrylonitrile butadiene styrene(ABS), polycarbonate (PC), polylactic acid (PLA), high-densitypolyethylene (HDPE), PC/ABS, polyphenylsulfone (PPSU), and high impactpolystyrene (HIPS). In general, the polymer is in the form of a filamentfabricated from virgin resins. There are multiple projects in theopen-sourced community aimed at processing post-consumer plastic wasteinto filament. These involve machines used to shred and extrude theplastic material into filament.

FDM is somewhat restricted in the variation of shapes that may befabricated. For example, FDM usually cannot produce stalactite-likestructures, since they would be unsupported during the build. Otherwise,a thin support must be designed into the structure, (a sprue), which canbe broken away during finishing. Fused deposition modeling is alsoreferred to as fused filament fabrication (FFF) by companies who do nothold the original patents as does Stratasys.

Binding of Granular Materials

Another 3D printing approach is the selective fusing of materials in agranular bed. The technique fuses parts of the layer and then movesdownward in the working area, then adding another layer of granules andrepeating the process until the piece has built up. This process usesthe un-fused media to support overhangs and thin walls in the part beingproduced, which reduces the need for temporary auxiliary supports forthe piece. A laser is typically used to sinter the media into a solid.Examples include selective laser sintering (SLS), with both metals andpolymers (e.g. PA, PA-GF, Rigid GF, PEEK, PS, Alumide, Carbonmide,elastomers), and direct metal laser sintering (DMLS).

Selective Laser Sintering (SLS) was developed and patented by Dr. CarlDeckard and Dr. Joseph Beaman at the University of Texas at Austin inthe mid-1980's, under sponsorship of DARPA. A similar process waspatented without being commercialized by R. F. Householder in 1979.

Selective laser melting (SLM) does not use sintering for the fusion ofpowder granules, but will completely melt the powder using a high-energylaser to create fully dense materials in a layer-wise method that hasmechanical properties similar to those of conventional manufacturedmetals.

Electron beam melting (EBM) is a similar type of additive manufacturingtechnology for metal parts (e.g. titanium alloys). EBM manufacturesparts by melting metal powder layer by layer with an electron beam in ahigh vacuum. Unlike metal sintering techniques that operate belowmelting point, EBM parts are fully dense, void-free, and very strong

Another method consists of an inkjet 3D printing system. The printercreates the model one layer at a time by spreading a layer of powder(plaster, or resins) and printing a binder in the cross-section of thepart using an inkjet-like process. This is repeated until every layerhas been printed. This technology allows the printing of full colorprototypes, overhangs, and elastomer parts. The strength of bondedpowder prints can be enhanced with wax or thermoset polymerimpregnation.

Laminated Object Manufacturing

In some printers, paper can be used as the build material, resulting ina lower cost to print. During the 1990's, some companies marketed 3Dprinters that cut cross sections out of special adhesive-coated paperusing a carbon dioxide laser, and then laminated them together.

In 2005 Mcor Technologies Ltd. developed a different process usingordinary sheets of office paper, a tungsten carbide blade to cut theshape, and selective deposition of adhesive and pressure to bond theprototype.

There are also a number of companies selling printers that printlaminated objects using thin plastic and metal sheets.

Stereolithography

Stereolithography was patented in 1986 by Charles Hull.Photopolymerization is primarily used in Stereolithography (SLA) toproduce a solid part from a liquid. SLA uses a laser beam to selectivelycure photosentitive liquid into the desired form in sequential x/ylayers. Stereolithography (SL) is widely recognized as the first 3Dprinting process and first to be commercialized. SL is a laser-basedprocess that works with photopolymer resins that react with the laserand cure to form a solid in a very precise way to produce very accurateparts. It is a complex process, but simply put, the photopolymer resinis held in a vat with a movable platform inside. A laser beam isdirected in the x/y axes across the surface of the resin according tothe 3D data supplied to the machine (the .stl file), whereby the resinhardens precisely where the laser hits the surface. Once the layer iscompleted, the platform within the vat drops down by a fraction (in thez axis) and the subsequent layer is traced out by the laser. Thiscontinues until the entire object is completed and the platform can beraised out of the vat for removal.

Because of the nature of the SL process, it requires support structuresfor some parts, specifically those with overhangs or undercuts. Thesestructures need to be manually removed.

In terms of other post processing steps, many objects 3D printed usingSL need to be cleaned and cured. Curing involves subjecting the part tointense light in an oven-like machine to fully harden the resin.

Stereolithography is generally accepted as being one of the mostaccurate 3D printing processes with excellent surface finish. Howeverlimiting factors include the post-processing steps required and thestability of the materials over time, which can become more brittle.

Solid Ground Curing (SCG), also known as the Solider Process, is aprocess that was invented and developed by Cubital Inc. of Israel. TheSGC process uses photosensitive resin hardened in layers as with the SLAprocess. However, in contrast to SLA, the SGC process is considered ahigh-throughput production process. The high throughput is achieved byhardening each layer of photosensitive resin at once rather than tracingit one row at a time. Many parts can be created at once because of thelarge workspace and the fact that a milling step maintains verticalaccuracy. Wax replaces liquid resin in non-part areas with each layer sothat model support is ensured.

These processes were a dramatic departure from the “photosculpture”method of François Willème (1830-1905), developed in 1860. The“photosculpture” method consisted of photographing a subject from avariety of equidistant angles and projecting each photograph onto ascreen, where a pantograph was used to trace the outline onto modelingclay.

DLP—or digital light processing—is a similar process tostereolithography in that it is a 3D printing process that works withphotopolymers. The major difference is the light source. DLP uses a moreconventional light source, such as an arc lamp, with a liquid crystaldisplay panel or a deformable mirror device (DMD), which is applied tothe entire surface of the vat of photopolymer resin in a single pass,generally making it faster than SL. Also like SL, DLP produces highlyaccurate parts with excellent resolution, but its similarities alsoinclude the same requirements for support structures and post-curing.However, one advantage of DLP over SL is that only a shallow vat ofresin is required to facilitate the process, which generally results inless waste and lower running costs. The EnvisionTEC Perfactory is anexample of a DLP rapid prototyping system.

Inkjet printer systems like the Objet PolyJet system spray photopolymermaterials onto a build tray in ultra-thin layers, (between 16 and 30μm), until the part is completed. Each photopolymer layer is cured withUV light after it is jetted, producing fully cured models that can behandled and used immediately, without post-curing. The gel-like supportmaterial, which is designed to support complicated geometries, isremoved by hand and water jetting. It is also suitable for elastomers.Ink jet printing of objects has become more rapid with the use ofmultiple heads or Multi-Jet Printing (MJP).

Ultra-small features can be made with the 3D micro-fabrication techniqueused in multi-photon-photo-polymerization. This approach uses a focusedlaser to trace the desired 3D object into a block of gel. Due to thenonlinear nature of photo excitation, the gel is cured to a solid onlyin the places where the laser was focused while the remaining gel isthen washed away. Feature sizes of under 100 nm are easily produced, aswell as complex structures with moving and interlocked parts.

Yet another approach uses a synthetic resin that is solidified usingLEDs. In Mask-image-projection-based stereolithography a 3D digitalmodel is sliced by a set of horizontal planes. Each slice is convertedinto a two-dimensional mask image. The mask image is then projected ontoa photocurable liquid resin surface and light is projected onto theresin to cure it in the shape of the layer. The technique has been usedto create objects composed of multiple materials that cure at differentrates. In research systems, the light is projected from below, allowingthe resin to be quickly spread into uniform thin layers, reducingproduction time from hours to minutes. Commercially available devicessuch as Objet Connex apply the resin via small nozzles.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a top view example of a capillary array;

FIG. 2 illustrates a top view example of an activation matrix array;

FIG. 3 illustrates a top view example of joined and unjoined voxels;

FIG. 4 illustrates a side view example of a capillary matrix;

FIG. 5 illustrates a top view example of partially cured voxels;

FIG. 6 illustrates a side view example of a 3D capillary array withmatrix and monomer;

FIG. 7, illustrates a top view example of photo conductive nodes andpartial cure voxels;

FIG. 8, illustrates a side view photoconductive spacer/node capillaryarray and further related details;

FIG. 9 illustrates a VAPM conceptual drawing;

FIG. 10 illustrates the present invention core assembly as well as otherdetails;

FIG. 11 illustrates a graph of voxel polymerization history ofproperties thereof over time and temperature.

DESCRIPTION OF EXAMPLE EMBODIMENTS ILLUSTRATING THE INVENTION

According to several embodiments, a device leverages several establishedelectromechanical, chemical, and fluidic technologies to create a novelmethod of producing three-dimensional objects at orders of magnitudefaster than current methods, and with greater materials variety andstrength.

In such embodiments, a continuous pressurized laminar flow of liquidreactive monomer passes through the underside of a porous non-reactivesurface, which is defined in this art as an extrusion platen.

Upon this extrusion platen is a curative matrix. A curative matrix caninclude a two dimensional indexable grid of excitable locations. Thecurative matrix an be described as having a matrix of indexablelocations defined by a row (x-index) and a column (y-location) accordingto a Cartesian coordinate system. A Cartesian coordinate system, forexample, may refer to a coordinate system that specifies each pointuniquely in a plane by a pair of numerical coordinates, which are thesigned distances from the point to two fixed perpendicular directedlines, measured in the same unit of length. Each reference line iscalled a coordinate axis or just axis of the system, and the point wherethey meet is its origin, usually at ordered pair (0, 0). The coordinatescan also be defined as the positions of the perpendicular projections ofthe point onto the two axes, expressed as signed distances from theorigin.

The curative matrix can also be described by another coordinate system,such as a polar coordinate system. A polar coordinate system refers to atwo-dimensional coordinate system in which each point on a plane isdetermined by a distance from a reference point and an angle from areference direction.

The reference point (analogous to the origin of a Cartesian system) iscalled the pole, and the ray from the pole in the reference direction isthe polar axis. The distance from the pole is called the radialcoordinate or radius, and the angle is called the angular coordinate,polar angle, or azimuth.

According to the two dimensional array in the Cartesian row/line system,the intersection of a row and line can define an activation location.The activation location can be the smallest addressable element in anall points addressable activation matrix; so the defined location of theactivation locations within the curative matrix can refer to thesmallest controllable location of the individual activation locationswithin the curative matrix. According to embodiments of the presentinvention, activation of curable material at multiple activationlocations within the two dimensional array of addressable activationlocations can be simultaneously, substantially simultaneously, orrapidly activated without mechanical movement of the extrusion platen.

Rather, a first two-dimensional layer of curable material can beaddressed and activated at multiple discrete locations in thetwo-dimensional array of the curative matrix prior to mechanicalmovement of the extrusion platen. Activation of the curable material ateach addressable location can be a result of light and/or heat generatedat each location to which an activation signal is sent.

Thus, where a 10 row and 10 column curative matrix is used, a firstactivation signal can be addressed to a first row (any of rows 1-10)column (any of columns 1-10) location. When the first activation signalcauses heat and/or light, for example, activation at that addressablelocation, a curable material is activated (e.g. at least partially orfully cured) corresponding to the first location.

Simultaneously, a second activation signal can be addressed to a secondrow and second column location that is different from the first row andcolumn combination. When the second activation signal causes heat and/orlight, for example, activation at the second location, a curablematerial is activated corresponding to the second location.

Thus, any number of the possible two-dimensional locations of thecurative matrix are addressed, thereby activating the curable materialat each addressed location.

After desired locations of curable material are addressed and activated,and a particular layer of an object is completed, the extrusion platenremains stationary and a Z-stage, to which the build object has beenaffixed, is advanced in a perpendicular direction in order to form asubsequent layer.

Next, this subsequent layer is made by once again addressing desiredlocations of the curative matrix, thereby activating the curablematerial at each addressed location. All subsequent layers are made intwo-dimensionally indexible arrays of curable material, thereby rapidlyforming a two-dimensional layer of an object with only one directionalmechanical movement of the Z-stage perpendicular to the stationaryaddressable extrusion platen in a layer-wise fashion.

Thus, a three dimensional build can be rapidly made in an at leastpartially two-dimensionally addressable layer-wise fashion as theZ-stage advances perpendicularly to the stationary extrusion surface ofthe extrusion platen.

Referring to the Cartesian system, the curative matrix can be ascreen-like electroconductive matrix that is attached to a top surfaceof the extrusion platen. The curative matrix is selectivelyelectronically addressed at coordinates that represent requisitegeometry of the cross section of the layer of the object to be created,much in the way a bitmap defines the shape of a two-dimensional object.

According to some embodiments, the invention includes a curativeconductive matrix atop an extrusion platen wherein an entire plane ofvoxels is cured simultaneously. One key to such embodiments is the factthat no longer are single or multiple droplets or rows of materialdeposited via a mechanical process to create a cross section layer of abuild object. Instead, an entire layer is simultaneously deposited andcured in position at the exact geometry required. This is achieved by anovel means via the novel build platen disclosed and illustrated herein.

According to several embodiments, the entire curative matrix can beaddressed at once, via a row-and-column “video driver” typeconfiguration, and at speeds and process similarly to a televisionscreen frame rate, rather than tracing x/y coordinates one row at a timesystem. As the curative matrix is addressed with current, a resistivelayer, which has been constructed between the x/y traces of the matrixis activated at the x/y intersection coordinates, and because thecurrent is sufficient where the addressed x and y currents intersect,the resistive layer thereby creates heat in that selected spot/locationof the curative matrix. In such embodiments, this heat creates acatalysis event in the monomer at the designated coordinates, therebycreating a voxel in that space out of the monomer passing therethrough.A voxel represents a value on a regular grid in three-dimensional space.As with pixels in a bitmap, voxels themselves do not typically havetheir position, (their coordinates), explicitly encoded along with theirvalues. Instead, the position of a voxel is inferred based upon itsposition relative to other voxels (i.e., its position in the datastructure that makes up a single volumetric image). In contrast topixels and voxels, points and polygons are often explicitly representedby the coordinates of their vertices. A direct consequence of thisdifference is that polygons are able to efficiently represent simple 3Dstructures with lots of empty or homogeneously filled space, whilevoxels are good at representing regularly sampled spaces that arenon-homogeneously filled.

The addressing of the curative matrix leverages flat screen digitalpassive matrix electronics to create entire build layers at refreshrates similar to those of a digital display or flat screen television,e.g. 30 to 120 times per second, or faster in some embodiments. Thecontinuous laminar flow of monomer ensures the rate of layer cure iscoordinated with the pressure and viscosity as the monomer passes thoughthe extrusion platen, and the movement of the Z-stage is alsocoordinated therewith. By controlling the current level via addressingprogramming, the level of resistive heat can be regulated to createseveral useful and integral states of cure of the monomer voxel itself,such as “self-valving” as disclosed and described herein. Self-valvingcan refer to a controlled and/or desired situation where a partiallycured monomer will close the aperture corresponding to the selectedcoordinates where no build is required, support structures, and thebuild object itself. Self-valving can also create an “envelope” for thebuild within.

Thus, significant embodiments of the present invention provide aCartesian (or other type or pattern) matrix of electrically addressedarray of conducting traces affixed to the flat surface of the buildplaten. Again, the build platen being porous, having tubes therethrough, or other channels extending through the depth to allow thecurable material to flow from one side of the build platen to anotherside of the build platen.

According to these embodiments, the build platen has multiple seriallyaddressable arrays, or matrices, for energy triggered selective voxelimaging and/or heat polymerizations. In some embodiments, the buildplaten is preferably porous because non-porous surfaces would requiremuch longer times for a meniscus of liquid build material to stabilizefrom side injected ports into a flat uniform build layer. The purpose ofthe Build Platen is to provide sufficient porosity to greatly shortenthe layer formation time. The liquid build material is pressurized orbiased to be continuously transported or extruded across a short areathrough the porous region of the platen and onto the surface whereinlies the Cartesian grid of traces, the matrix, thus saving timeotherwise spent from a longer distanced side injected configuration.

In its basic embodiment, a passively addressed electro-conductive orconductive Cartesian matrix is selectively addressed so that the liquidis extruded much in the way a video is addressed, and as it passesthrough the porous build platen it is selectively cured to create thespecific geometry of that build layer.

Active performance can be achieved utilizing a uniformly passivatedoxide layer other uniform material which is integrated between thecrossed intersections of conducting x and y traces, and will selectivelyprovide resistance heating or light energy in a manner analogous to aflat screen display, but for this purpose for catalysis or phaseseparations of thermoset or thermoplastic differentiation.

Successive layers can thus be applied using this build platen and avertically controlled Z-direction articulated stage, which can bemechanically sequenced to move away from the build platen's surface asmeasured precise layers are sequentially addressed with new materialforced through the platen.

In some embodiments, the single mechanical Z-stage may offer a bindingsurface so that the build material will have additional means of beingdrawn away from the build platen's surface. The build platen in turn,can be coated by a non-stick release coating such as Teflon, silicone oran inorganic material such as boron nitride for the purpose of allowingsuccessively released layers to be moved away from the build surface.

The build platen may also be made acoustically live also for the purposeof aiding in the release of successive layers from the platen. Theplaten may have a magnetic or electric field applied for the purpose ofaligning composite dispersed material or molecularly sensitive moleculesusing field-aligning effects.

The simplest embodiment is comprised of an open cell substrate of aninert material, with the conductive traces bonded on one side in anaddressable array, which allows a heat signature to be appliedselectively by the traces in an image defining manner layer uponsequential layer. Other relatively more complex embodiments of theplaten may include a photo conducting pad such as cadmium selenide andothers between the conducting traces, allowing variable heat controlfrom a corresponding light image focused on the side opposite thetraces.

Where the platen is comprised of an array of fused parallel hollowlight-guide fiber-optic sections, the porosity of the platen not onlywill conduct liquids to the trace array side, but varying intensities oflight, transmitted through these same light-guide fiber-optics canrender a wide range of conducting variability to the electrical energybeing transmitted between the orthogonal traces.

Secondary dye- and/or catalyst-embedded trace arrays can also be placedas a replaceable accessory on the opposite side of the traces in closeproximity to the bottom surface of the platen, for the purpose ofallowing reel-to-reel indexing/alignment to coordinate with imagingcolors and material choices. This can generate photorealistic color. Thesecondary dye and/or catalyst embedded web-addressable material wouldpreferably be a material such as paraffin, which has a lighter densitythan the build monomer materials, having a lower melting point, thusallowing for vertical diffusion up through the build platen, andprobably not necessarily consisting of as high a resolution as theactual polymerized finished object.

UV inorganic LEDs may also be placed as micro-actinic sources sandwichedbetween the traces for the purposes of localized curing. Thus, aphoto-chemical result of an activating energy can be addressed accordingto the matrix. Generally the term Actinic refers to electron bombardmentor ion bombardment, however in general Actinism is the property oflight, including visible light, radiation that leads to the productionof photochemical and photobiological effects. Actinic chemicals caninclude silver salts, such as are used in photography and otherlight-sensitive chemicals.

In addition to UV catalysis, heat curable monomers have a variety ofblocked catalyst moieties available for the purpose of a wide range ofpolymerization reactions.

The liquid monomer that is passing through the platen is of a low enoughviscosity to move freely. In some embodiments, is uses SelectiveAddition Polymerization via in situ Latent Heat Catalysis. The monomercontains a catalyst, which will not be activated until the desiredtemperature has been reached for cure, otherwise known in the art as alatent heat catalyst. In some embodiments, epoxy formulations, utilizinglewis acid amine blocked salts, with various known accelerators such asvinyl ethers, Styrene, acrylate acrylated polyurethanes and otherpolymerization systems, which can be initiated by lightly bonded(blocked) via free radical liberation such as peroxides, various blockedpoly isocyanates can also be used in situ with polyurethane andurethane/epoxy modalities as well as unsaturated polyesters asco-polymers wherein said benefits of impact resistance hardness orflexibility characteristics are of special interest, all can bedeposited from a relatively inactive state onto a staged environmentwherein elevated activating temperatures commence local polymerizations.This particular approach to additive manufacturing, otherwise known inthe art as 3D printing or rapid prototyping, has many advantages, whichinclude: less energy for curing and more liberal considerations foropacifying pigments or composite additives.

Such mechanisms for delivery include the current subject invention, andin addition ink jet deposition, nozzle extrusion, repeated lithographicapplications, silkscreen or masked templates such as a stencil. Repeatedapplications to match desired cure rates can be matched to the variouschemistries, which may be employed. In some embodiments, such as ink jetuse of this chemistry method, the liquids can be used in opaque ortransparent materials, with RGB or CMYK, or other color dye or pigmentsadded so that discrete droplet deliveries can create photorealisticcolor in transparent or opaque versions, which is more difficult in UVcatalysis, since color impedes the curing when UV is blocked, as is thecase with color and opacity.

To create support structures with the latent heat catalyzed monomer,there is also the ability to impede crosslinking of the monomer/oligomerchemistries, by secondary pre-applied chemical inhibitors for thecreation of negative spaces, which may be supportive but not otherwiseconsidered structural for the end product. These may be easily removedin a post-manufacturing cleaning step. The selected material used toimpede the polymerization of the monomer be locally introduced by thesame colorizing mechanism aforementioned, and can have a discrete heatsignature or other activation method to create these selective supportmaterials such as gel, in a compromised polymerization, a sand granuleor other support.

According to some embodiments, the platen is constructed with the hollowcapillaries thinly metalized as resistance heat elements and a secondaddressable orthogonal trace structure on the opposite side of theplaten, for the purpose of heating the entire capillary for the purposeof selective thermoplastic extrusion.

Ionic liquids bearing various dissolved metals are also employed in thematrix for the purpose of selective image deposition by means of localvoltage differentiated electrolysis upon the image architecture of theplaten in some embodiments.

Additional material chemistry applications for this invention have beendiscovered in view of the variety of epoxy, acrylics, polyurethanes,metals and bio-compatible materials. As the complexity of applicationrises however, the expense of the platen rises for different curingmechanisms.

In some embodiments, the platen itself may include auxiliary temperaturecontrols, volume sensitive pumps, a galvanometer to ascertain localmaterial densities, ultrasonic transducers, a precisely indexedsingle-stage apposite platen to draw material away from the imagingplaten, a wash tank for excess or contaminated materials and aneutralizing chemistry accounting for environmentally responsibledisposal.

The voxel platen, methods for making the platen, and components thereof.

There are a plurality of ways in which to create the voxel platen,however many involve orderly arrays so that proper row and columnaddressing can be achieved. In a preferred embodiment the voxel platenis constructed as follows:

A bundle of fiber optic cables that are made of borosilicate or othertype of glass are heat-sintered together in a group that creates thedesired shape. This can be referred to as a “loaf.” The cables can beorganized to create a Cartesian (orthogonal) alignment, which is onepreferred embodiment. The bundle of fiber optic cables can also bebundled to create hexagonal or other types of patterns withcross-sectional geometries in addition to circular, tubular, elliptical,rectangular, square, and hexagonal. For the purpose of the a firstadvantageous embodiment, Cartesian methods would be utilized tofacilitate row and column addressing and later bitmapping of images inan interface software.

By way of explanation on the sintering of the fiber optic cables, solidsdo not transition to liquids at one time. They transition in phases,therefore the exterior of the fiber optic cable begins to liquefy beforethe inside of the cable. This creates an adhesion layer on the outsideof the cables. When this loaf is created, it is then cooled and removedfrom its encasement. It can be created at nearly any dimension asdesired, ranging from several millimeters to several feet. For thepurpose of this invention and in several preferred embodiments it wouldbe anywhere from 150 cm×150 cm up to 300 cm×300 cm width, and thepreferred length of the loaf to generate the number of desired platensto be created, and to be cost effective for the manufacturing processingrequired.

After the loaf has been sintered and cooled, it is sliced via variousmeans appropriate for glass, polished, and if the fiber optic cableswere not hollowed, it is etched via acid or other appropriate solvent,or if the fiber optic cables were hollow, it is called the ExtrusionPlaten, and it will then be ready to be constructed into the voxelplaten.

As pertains to acid etching, if the fiber optic cable is not hollow andmerely represents a refractive gradient cross section, the higheralkaline core selectively etches first, making it easy and controllableto selectively etch the center out of the cable, as is known in theglass art.

Sintering the fiber optic cables together means that though the fiberoptic cables remain intact whether they are hollow or filled, only theouter surface of the fiber optic cable adheres to the one next to it,thereby creating a bond during the heat sintering process. They remainintact and in place to create an extremely precise capillary-alignedExtrusion Platen with minimal tolerance variation.

This is a process in the glass art as is practiced for genomics, generaland chemical assay processes, bioassay, night vision optics,scintillation photo electric chambers, etc. However, the use ofcross-sectional fiber optic porous glass for the purposes of creatingthree-dimensional objects is novel, and is claimed in this invention asthe extrusion Platen.

When the glass loaf has been sliced into cross-section and polished, theholes created therein are referred to as capillaries.

The slicing of the loaf by various means appropriate to the art, such asdiamond saws, common to the art in silicone manufacturing arena, waterjet cutting, or other means, is effected avoiding the generation ofcanting or convex surfaces on the glass, to ensure flatness. Finalleveling is generally completed via a polishing process common in theglass art. This finish process assures micrometer accuracy for the buildprocess, which will later occur thereupon.

The smaller size platens can be tiled to increase the overall platensize and supported via coffering underneath, preferably with anothersection of platen that has been laid between the seam of the tiledplatens, and capillary holes on the same centers but larger and etchedto align with the holes of the platen above and indium heat bondedtogether. The capillary holes would be consecutively larger with eachlayer of support to prevent the need for increased pressure from thefuture monomer manifold below. Other means to coffer the tiled ExtrusionPlaten would also be precision knife-edge glass to support the tiledporous glass, similar to wing ribs or roof trusses, creating a largercontinuous Extrusion Platen. In this fashion, larger and larger finishedVoxel Platens can be created, and thus larger finished objects orgreater quantities of finished objects can be created in the finaldevice. For the purpose of this explanation, the size of the VoxelPlaten is not limiting to its general methods of construction.

It should be noted here in its preferred embodiment the fiber opticcables have capillary hole diameters of 10 μm each. Based on thispreferred diameter, they are on 25.4 μm centers, or one mil centers.This is important to note because that means that the resolution orholes per linear inch equals 1000. Since the preferred embodiment has aCartesian array, the entire Extrusion Platen will have 10 μm holes, 1000per inch, 15.4 microns between each hole, which equals 1 millioncapillaries per square inch.

After polishing and etching, the entire platen can be annealed byheating to a temperature whereby internal stresses are relieved, as isknown in the art of annealing.

After completion of the glass Extrusion Platen creation, the entireplaten is coated with an inhibitor. The inhibitor would consistprimarily of nano rutile phase titanium dioxide particles suspended in asodium silicate solution of very mild concentration and low viscosity,allowed to dry, then fixed with acid. It is then washed with a bufferwater solution. This is effected after annealing. This a very thinlayer, which inhibits any monomer from curing when in contact with theglass of the Extrusion Platen, which is important since objects must bebuilt only on one side, the surface of the final Voxel Platen.

The inhibitor is a locally polymerization inhibiting layer that protectsagainst runaway polymerization through the platen. It works by slowingdown the catalysis reaction of the monomer and raises the reactionthreshold to thereby prevent catastrophic occlusions and the monomer'spotential dendritic polymerization inside the capillary. There is aplurality of inhibitor options available; nano titanium dioxide is notthe only inhibitor, however it is preferred for this embodiment. Othersmay include hydroquinone, phenoquinone, benzoquinone, boric acid, andothers as are known in the Chemical arts. Titanium dioxide is preferredfor this embodiment.

After the inhibitor coating has been completed, the capillaries are thenfilled with wax or other easily removed meltable material to protectthem during the electro mechanical assembly and construction phase ofthe Voxel Platen.

Regarding the traces on the glass includes:

Carrier Film. When a perfectly flat platen has been created and filled,then the first layer of electro-conductive copper traces will beconstructed thereupon. This is referred to as the Curative Matrix.

In order to construct a preferred embodiment of the voxel platen, pureelectro-conductive copper traces can be created in the following manner.It should be noted that any conductive metal maybe used, however purecopper is the preferred embodiment because it has the highest level ofelectro conductance of metals available, and because it forms a naturalsemiconductor oxide layer which will be explained in the next part ofthis construction description. Alternative materials include transparentelectro conductive traces known to the art such as indium tin oxide,which can be employed.

An approximately two millimeter thick piece of polyvinyl butyrate orsimilar film, such as cellulose, gelatin, or other material that isdissolvable, is employed in this advantageous example. It should benoted here that in other embodiments other materials for carrier filmcould be used, such as metals, which can be easily vaporized, such asgallium.

Construction of X Traces: For the X traces, or row of traces, a roll ofcopper is coated on two sides via vapor sputtering or other method knownin the art, with adhesive metal(s) such as Indium in its preferredembodiment. The copper will be manufactured at the thickness requiredfor the conductance needed for the heat that is going to be generated,as per the requirements of the selected monomer, which will be used inthe building of objects after construction. In general, this will bebetween a half a mil and one mil thickness (12 to 25 μm thick). Then itwill be oxidized on two sides with ammonia It will then be bonded to thecarrier film via calendaring. After the carrier film is coated with theappropriate thickness of conductive metal, in this case copper, next itis coated with a conductive adhesive at the thickness required for thematerial application desired. In its preferred embodiment, this adhesivemetal would be indium. This will later serve as a bonding agent as willbe explained.

In its preferred embodiment, this copper will be laser ablated using anExcimer laser. Prior to the laser etching and calendaring to the carrierfilm, both of the metal surfaces will first be coated with an oxidationlayer, oxidizing the metal as is known in the art. This will serve as aresistive layer and creates a semiconductor bandwidth layer. When theoxidized metal(s) and adhesive layers have been deposited at theappropriate thicknesses on top of the carrier film, then traces arecreated utilizing an Excimer laser, which will cut the metals but leavethe carrier film intact. This will be important for construction as willbe explained.

The average size of the laser-ablated traces is 10 μm however they canbe much smaller or larger as the embodiment, conductivity, andchemistries require. The conductive traces are not limited to thesesizes, however for the purposes of this embodiment these are preferred.

In addition to a straight cut, the excimer laser can be controlled toangle slightly as the traces are being ablated. In this manner, apyramid cross section is generated. Thus in construction the portion ofthe metal in contact with the carrier film will be 10 μm wide, but beangled so that the top surface of the ablated metal will, for example,be 4 to 7 μm in width. The conductive traces are not limited to thesesizes, however for the purposes of this embodiment these are preferred.

When straight traces are created, it is the simplest method ofconstruction. After the traces have been laser ablated, the carrier filmwith the ablated traces is flipped over onto the voxel platen andaligned under a wide field microscope to land on the 15.4μ spacesbetween the capillary holes. A readily available thermal metal non stickplate such as is used in tee-shirt manufacturing, or to apply decalsafety instructions in automobile interiors, as are commonly used tointer-bond plastic layers, is applied to let the indium or otheradhesive melt into the glass and thereby bond the entire set of tracesdirectly to the glass in position. Next, a solvent bath is effected toremove the carrier film leaving only the pure copper and indium tracestructure directly on the glass.

Angled X Traces: It should be noted here again that the excimer lasercan cut the traces in various ways. The first embodiment would havestraight cut 10 μm wide traces and since both sides are coated withindium or other adhesive, one would not need to transfer to a secondaryfilm. However, if a smaller contact area is desired at the intersectionsof traces, then the laser ablation will be done at the desired anglegenerating a smaller width on the top side of the trace. In this casesince it is desired that the larger width section of the trace be indirect contact with the glass, that would necessitate transferringcarrier films for the X layer of traces. (It would not be required forthe Y layer of traces since they would already have the smaller widthtrace on top in this instance.) Since the X trace metal(s) are oxidizedand adhesive on two sides, then affixed to carrier film, they can belaser etched to whatever size traces are required and used in anydirection top or bottom to be affixed to the extrusion platen.

Angled cuts generate a smaller contact area where the traces intersect.The desired effect of the smaller contact area is to create anelectroconductive resistive heat moment, which is shorter in duration,due to the fact that that it has a much higher surface to volume ratio.It will also facilitate the movement of the monomer through this passivematrix construction with less resistance for the flow dynamic during thebuilding of voxels.

If the X traces are created in the pyramid or angled shape crosssection, then an extra step to invert the traces is needed beforeaffixing the traces to the glass, since the smaller side has to be ontop in the finished platen an the Excimer may not always undercut thetraces, depending on materials and suppliers employed.

In the case of the angled traces, the first layer will be inverted byheat transference to a second carrier film, the second carrier filmbeing of a higher molecular weight than the first. The 10 μm wide traceswith smaller tops are then transferred to the lower molecular weightfilm via heat transfer. Then the two films sandwich the metals layerwith the smaller width on the secondary film. The first carrier filmwill release from the metals leaving the metals on the second carrierfilm. Now the carrier film is ready to be flipped over (like a decal)and laid a top the extrusion platen to create the X traces for theCurative Matrix.

The 10 μm wide laser etched traces will be microscopically aligned withthe 10 μm capillary holes so that they are in sitting on the 15.4 μmsolid area between capillary holes.

The carrier film is then heated so that the in the adhesive melts andaffixes to the glass beneath it after it has been aligned. Since bothsides of the copper film will be coated with adhesive metal prior toattaching it to the carrier film, the film will be reversible top orbottom.

After the X layer of traces has been bonded to the glass, a solvent bathwill be utilized to remove the carrier film. After which, there will becopper and indium conductive X trace layer directly affixed to theExtrusion Platen.

Construction of the Y Traces: The same process is effected for the Y orColumn traces. However, in the case of straight or angled traces, theywill not need to be transferred to a secondary carrier film.

In addition, prior to the laser etching, the metal surface will first becoated with an oxidation layer, oxidizing the copper into copper oxidewith ammonia or other method known in the art, or oxidizing the indiumor other selected metal(s). This will serve as a resistive layer andcreates a semiconductor bandwidth layer. The passivated oxidation layerswhere the traces cross allow for a semiconducting band gap, which allowscurrent to flow selectively at any trace junction that requires heataddressing via a final layer of resistive material, which also createsmost of the heat via said resistance layer. On top of the oxidationlayer, this resistive layer is applied. This is comprised of nanoparticulate carbon and ceramic materials, which will generate heat whencurrent is present. This is the Y or column layer and does not have tobe transferred to a secondary film.

(It should be noted here that the resistive layer can be applied to theX traces instead, as long as the end result is that the two sets oftraces' oxidation layers are touching the resistive layer in asandwich.)

This film is then directly flipped over onto the X layer orthogonallyand aligned microscopically so that the cross sections are localized toone edge of each circle of the capillary orifice.

The same process of heating to create a bond to melt the indium isrepeated and the Y traces are affixed to the metal layer beneath. Thenthe solvent bath is repeated to remove the carrier film from the Ytraces.

After the X and Y traces, which comprise the Curative Matrix, have beenaffixed to the Extrusion Platen and the carrier films have beencompletely removed, the entire mechanism is cleaned and dried viasolvent and air. It is then ready for the nonstick coating.

Non-stick Coating: A coating of Teflon, boron nitride or similarmaterial is utilized to coat the Voxel Platen. It coats the entireassembly except for the capillary interiors. They are still protected bytheir wax coating that was applied after the inhibitor.

As a final finishing stage, after the release coating is completed, itmay be necessary to dress the appropriate corners of the intersectionswith a finished dressed laser ablation, creating a micro-divot, viaexcimer laser to thin said release layer thereby biasing the heatsignature closer to the desired voxel capillary.

When the nonstick coating has been fully applied and cured by CVD orvapor deposition, then the wax will be removed via gentle heat andwashing with appropriate solvent, vaporization, pyrolization, or otherappropriate method.

Once these steps have been completed the assemblage has become the VoxelPlaten, and will be ready for addressing. This entire process can beautomated for mass production.

Several illustrations of these machines, portions thereof, andinterchangeable aspects are hereinafter discussed with reference to thefigures.

“Platen” (used by itself alone). The platen can be referred to as thesurface upon which the object is built, in any phase of the platenitself's construction, which can be curved, planar or other shapedepending its planned function, with at least one common plane on atleast one axis but preferably two. For the purpose of this presentinvention in its preferred embodiment the platen can be defined as aflat plane. Future embodiments will utilize other shapes of platendepending on purpose and object geometry requirements, depending also onits design purpose. The term Z-stage platen is also used to mean thedevice which moves perpendicularly to the build plane/platen, and servesas an adhesive platform to move the built object away from the buildplane/platen in some embodiments, however it is generally referred to asthe Z-stage platen and not as platen alone.

“Extrusion platen.” The Extrusion Platen can refer to the platen throughwhich the build material liquid passes. It can be the capillary glass,metal, porous ceramic, stone or other material through which the buildmaterial can pass. It is then built thereupon after it has beenactivated with the curative matrix. It can be configured to encompassthe properties and shapes of the platen above. For the preferredembodiments in this specification, it is planar.

“Voxel platen”. The build platen can also be referred to as the voxelplaten, and also refers to the finished extrusion platen with theCartesian, polar, or other configuration curative matrix thereupon.

“Curative matrix.” The Curative Matrix is a Cartesian or other array ofelectroconductive traces that serve to generate current, which activatesa resistive or reactive layer to cure the monomer build material thatpasses there through.

FIG. 1 shows an array of capillary tubes of a build platen from a topview. FIG. 1 is a representation of the build platen porous substrate.While there is a plurality of material that can be utilized, onepreferred embodiment includes a bundle of fused fiber optic cables, eachwith an inner diameter of about 8-10 microns, for example. The fiberoptic cables are fused and supported then sliced cross-sectionally tobecome a light transmitting extrusion platen that is impervious, orrelatively resistant, to varied temperatures used to cure the materialpassed there through and can also transmit light for some embodiments.Other materials with which to construct the extrusion platen includegranular materials, which offer a fused open celled porous structuresuch as glass microspheres, sintered sand, and also plastics which havebeen sintered. The material should be non-reactive and chemically inert,according to some preferred embodiments.

FIG. 2 is an illustration of the relatively simple platen architectureaccording to FIG. 1 and other embodiments of the inventions disclosedherein. In FIG. 2, element 201 is a Y-axis (e.g. insulated copper)trace. Element 202 is an X-axis (e.g. insulated copper) trace. Element203 identifies open micro-tube channels. And element 204 illustratessolid fused tube-support material.

FIG. 2 illustrates a curative matrix including a porous substrate thathas been directly coated with a non-stick coating. According to thisembodiment, the platen is passively addressed using a digital matrix ofcopper wires (traces or filaments) orthogonally set and fixed to carryCartesian plotting of electrical current voltage so that the extrudedheat sensitive monomer with a latent catalyst embedded therewith willcure into a voxel at the point of contact between the resistive heatspot on the curative matrix and the liquid. Other embodiments of thismatrix include any reactive addressable porous matrix, which can bealigned to cure the extruded monomer or curable liquid in a controlledfashion to create the cross section geometry voxels in an entire layerat once. Thus, any electro-conductive fashion to create thecross-section geometry voxels in an entire layer at once. And, anyelectro-conductive material, such as including copper, indium tin oxide,which are examples in the flat-screen display industry can be used.

Thus as illustrated in FIG. 2, a passive matrix construction can be usedin some advantageous embodiments. This passive matrix construction canbe addressed by a video type of signal in a Cartesian multiplex array asdiscovered by this inventor. The matrix can also be addressed with aVAPM passive matrix SAW MEMs array disclosed by this inventor in U.S.Patent Publication 2009/0051863 A1 as a simplified addressingarchitecture, and particularly fast and rapid indexing of the matrix andcreation of the objects as disclosed herein.

In these embodiments, traces are arrayed at overlapping ninety degreeangles and have passivated oxidation layers between which there is aresistive or other reactive layer where the traces cross, which allowfor a direct heat conversion via electrical conduction because of thelocal resistance supplied by the resistive layer between the oxidelayers.

FIG. 3 illustrates a top view of joined and un-joined voxels accordingto various embodiments. Element 301 references unjoined polymerizedspherules. Element 302 illustrates conjoined polymerized solid crosssections. And, element 303 illustrates uncured monomer.

As shown in FIG. 3, once the build platen has been activated, a pool ofpressurized or otherwise pumped latent catalyzed monomer or othercatalyzable substance is passed through it. As it passes through theelectro conductive matrix selectively cures the monomer into voxels inan entire Cartesian plane all at once thereby creating an entire layerof a build object in less than a second, in many embodiments. In someembodiments it is as fast as 1/200ths of a second. Then a Z-stage axismoves the Z-stage platen upwards perpendicular to the build surface to asubsequently determined “correct” increment corresponding with athickness of the voxel and the next build layer is subsequently created.

In some embodiments sequential planes of voxels are deposited inhundredth s of seconds, and an object builds rapidly in the Z-axisdirection (vertically). There can be a Z-axis platen platform elevatorabove the object that is adhesive and there may be an extra layer in thebuild object that is assigned an adhesion geometry to secure the builtobject to the Z-stage elevator until such time as the object iscompleted and the object is removed from the Z-stage elevator.

Some material in the voxel build may not require the Z-stage elevatorand the voxels may build naturally as the pressure from below isnaturally pushing upwards. In similar fashion building from the topdownwards and letting gravity pull the monomer through the extrusionplaten can also be used. Thus, the build object Z-stage would naturallyoccur as a product of gravity in such embodiments. Thus, theseembodiments can depend on the material used in the build process.

Resolutions of 1/1000^(th) of an inch and more coarse designs can beachieved with this method depending on how software is programmed toassign the digital signal resolution and the speed and exotherm ofchemistry selected. For example, a lower resolution “rough draft” orrough prototype of an object can be assigned a lower resolution and willhave less voxel build planes, thus a shorter build time, howeverchemical properties will be calibrated to coordinate.

Color embodiments are disclosed herein and can be integrated at any timeduring any of the embodiments according to the various disclosedinventions. In addition, opacifying of a clear curable liquidcombination can be used so that opaque and transparent material as wellas colors can be used in any combination to create a photorealistic 3Dobject.

Since the matrix can be addressed like a high definition video screenand the images of each layer of the build geometry can be sequentiallyaddressed throughout the build platen, entire planes of the build objectcan be deposited as fast as the cure cycle of the monomer will permit.Some of these chemistries produce layers at a rate faster than for a 1micron voxel thickness curing stacked at 2 mm per second in verticalheight. The VAPM or multiplexed digital signaling permits 200 layersper-second to be deposited in a fully cured state. Currently somechemistries' cure times exceed the driver-signaling rate as discoveredby the inventor. Hydrodynamic linear motion control can be included asrequired.

A bifurcated independent unbounded voxel may also be formed continuouslywith the fused image sections so that support material is always presentfor local extension or island structures, as shown in FIG. 3. Referringstill to FIG. 3, an indexed moving Z-stage platen matching thedimensions of the imaging platen moves independently away from the buildsection, serving the purpose of maintaining equal depth (e.g. thickness)of layering and a surface for attached solidified material to move incoordinated fashion throughout a build cycle.

FIG. 4 illustrates a side view of the build platen. As monomer is fedthrough the fused hollow capillaries (e.g. as shown in FIG. 1),dissolved blocked catalyst is activated locally as the monomer emergesnear the individually addressed heat source where the traces cross (e.g.as shown in FIG. 3).

As shown in FIG. 4, element 401 refers to a 90 degree metal trace array;and element 402 references a 90 degree metal trace array that isperpendicular to metal traces 401. Element 403 references a fused tubesupport material between the tubes and element 404 references one ofseveral hollow tubes.

FIG. 4 shows an illustration of a side view of the capillary platen withthe metal or electro-conductive traces in place. Similarly, from FIG. 3,which is applied to this FIG. 4, however it is to note that thesefigures are for illustration purposes and actual dimensions may vary inany of the embodiments disclosed herein, but the teachings of thevarious embodiments of the machines and process are shown and oftenemphasized for illustration purposes.

FIG. 5 illustrates a top view of partially cured voxels. As shown,element 501 references un-joined polymerized spherules. Element 502references conjoined polymerized solid cross-section. Element 503references uncured monomer, and 504 references partially cured gelledmonomer (e.g. to turn capillary off).

In order to regulate the flow of monomer through the capillary platen,an on-off function can be created using a partially cured voxel ofmonomer which is created by an incomplete electrical or heat signal formthe matrix to make the gelled monomer into a “skin,” which prevents themonomer from passing until it has been addressed again and the cure onthe voxel has been completed. When the monomer has been only partiallycured it has high adhesion, which allows it to stay in situ on thenon-stick platen and traces. However, at the time of final cure it losesits adhesive properties and becomes a part of the build item, ready forthe next upsurge of fluid to attach and cure thereto.

This can be used to create selective supports for negative spacegeometries. Another method of supporting negative space geometriesincludes the creation of selective non-connected voxels in the negativeareas to generate a sand bed, which will support the negative space andcan be easily disposed of as solid waste.

The uncured monomer appearing in the illustration is the result ofun-signaled Cartesian points and can be washed away after the object isfully built or as shown in FIG. 5.

In FIG. 5, the unneeded Cartesian locations can be stopped or skinnedover to stop monomer or liquid flow until they are needed, by a partialcure process expounded in FIG. 5. This can eliminate the need for anywasted monomer or liquid in some or most cases.

Referring to FIG. 6, a side view 3D capillary array with matrix andmonomer reservoir is shown. Element 601 references a 90 degree metaltrace of an array. Element 602 references a 90 degree metal trace arraythat is disposed below and perpendicular to trace 601 of the first tracearray as shown. Element 603 references a fused tube support material;and element 604 references a hollow tube as disclosed herein. Element605 references an oxidized surface layer. Element 606 references amonomer reservoir wall, element 607 references a monomer reservoir,element 608 references a monomer reservoir inlet, and element 609references a non-stick release layer.

FIG. 7 illustrates a top view of photoconductive nodes and partial curedvoxels. Element 701 references un-joined polymerized spherules, element702 references conjoined polymerized solid cross section, element 703illustrates uncured monomer, element 704 illustrates partially curedgelled monomer (e.g. turns capillary off), and element 705 referencesphotoconductive inter-trace nodes.

As shown, in the light sensitive embodiments, Cadmium Selenide Nodes orother such material can be at each intersection of the traces viaelectro-deposition or CVD or other means. These are photoconductive.This is a remote method of addressing the X and Y traces in the matrixthat are already biased with the same voltage and awaiting stimuli.

Therefore, when the Cadmium Selenide nodes are stimulated locally bylight that transforms the Cadmium Selenide or any other photoconductingmaterial into an electrical conductor. This is an alternate opticallight-activated method for gating the electrical current and activatingintersections instead of an electrical signal from addressing withdigital drivers. The current flowing between the orthogonal X and Ytraces is creating heat via a resistive layer. In this fashion heat iscreated to cure the monomer. The fiber optic build platen permits lightto pass through it and activates the nodes. The build platen made offiber optic capillaries that are bonded together and sliced incross-section, which is serving as an extrusion platen, is actually anextremely fine optical element in its own right, as is known in theoptical glass art, howveri is use in this method is novel and isclaimed.

Utilizing the nodes therewith creates a light stimulated embodiment,which can then be addressed via sequential projected images.

These projected images can come from devices such as a cell phone withan application (app) for this purpose, a pad, tablet, or iPad alsooutfitted with an app, or other software, resident or not, for thispurpose.

What will also be claimed and included within the disclosed machines andprocesses are RAM and/or ROM including computer executable instructionsfor causing a processing device, e.g. a computing device, to carry outthe methods and processes disclosed herein. Such instructions cancontrol a machine for creating an object or model the object and workwith the machine to make the object. The machine can be controlled tovary the object mid-manufacture, and the object created can bemanufactured in varied controlled methods that include variations intime as to layered-object creation and the use of different monomers orother curable materials. Color can be controlled, and changes indensity, resiliency, and other mechanical properties of the material canbe controlled based on chemistry, control, or electro-mechanicalcontrol, and/or fluidic control and temperature at any stage asdisclosed elsewhere herein.

With only the topmost layer being selectively addressed, monomerreactions for thermosetting materials may also progress, as shown inFIG. 7. A proximity trace embedded film with low melting point carriermedium, as shown in FIG. 7, can selectively produce colored dyes,catalyst or synergist materials to be conducted through the platen viathe capillary or other porous array into the build section surface. Apartially cured voxel serves as an off valve for monomer transport viacapillaries, as in FIG. 7.

Thus, the movable Z-stage platen can be above the voxel platen that theobject can attach to. Because in one preferred embodiment the extrusionplaten is stationary on top of the monomer manifold and as the object(s)are built the Z-stage moves up in accordance with the thickness of thelayer just built, and the object being built attaches to it to releaseany pressure and create an accurate non-distorted object build. If theweight of the object is pressing down on the monomer as it comes up,this could flatten the layer of voxels unless the Z stage holds theobject. The platen can also include not only the area that is doing thebuilding, but also the platen that holds the object to move it away fromthe building extrusion area as it is “grown.” There are also buoyancymechanisms that can be employed by emmisible secondary liquids, whichalso serve the purpose of cooling any exotherm.

FIG. 8 illustrates a second circuit array that provides a circuit routefor electrical current to pass through the first surface circuit arrayto emerge via an island conducting channel which is a metalizedcapillary thereby offering a conductive path between the two sides ofthe platen illustrated in FIG. 8. A double sided trace array allows theplaten to be used in alternate build modes, selectively allowingthermoplastic materials passage via a Tg channel as shown in FIG. 8.

FIG. 8 illustrates a side view of FIG. 7. FIG. 8 illustrates a side viewof a photoconductive spacer/node capillary array and related details.Element 801 refers to a conductive contact ring. Element 802 refers to aconductive film layer. Element 803 refers to a fused capillary material.Element 804 refers to a 90 degree conductive trace. Element 805 refersto a 90 degree conductive trace perpendicular to element 804. Element806 refers to a hollow capillary. Element 807 refers to a conductivecontact ring. Element 808 refers to a 90 degree conductive trace.Element 809 refers to a photoconductive spacer/node. And, element 810refers to a non-stick release layer.

FIG. 9 illustrates a VAPM conceptual drawing. Tunable timing for curingwith the VAPM matrix is illustrated. This diagram represents an exampleof the addressing frequencies from the fastest passive matrix addressingpossible, which uses MEMS in this embodiment. By using a SAW MEMspassive matrix array that is addressed by a multiplexed analog sweeperchopped by and slaved to the clock in a square wave video signal,addressing can occur at 4 MM times per second, far faster thanpreviously known chemistries could cure without explosion. However,slowed or adjusted to the frame rate that matches the chemistry, thismethod of addressing is the perfect embodiment to adjust and tune toselected chemistry is being used. This can also be included in theembodiments that are used for visual addressing.

FIG. 10 illustrates a Voxel machine core assembly. Element 1005 refersto a 3D build chamber, element 1010 refers to a Z-stage platform.Element 1015 refers to a liquid build material manifold, element 1020refers to a liquid build material reservoir, element 1025 refers to apower supply, element 1030 refers to a precision micro-pump, element1035 refers to a Cartesian addressing driver, element 1040 illustratesthe build platen with capillary and activating trace array, and element1045 illustrates a Z-stage screw assembly embodiment, however hydraulicsor other methods may be used.

FIG. 11 illustrates a voxel polymerization history. As shown, astemperature rises polymerization occurs and material goes from liquid togel to solid. If left as gel by incomplete curing this closes or“valves” the capillary and will not permit more monomer to pass until ithas finished curing by another signal addressed as desired. Thus, any ofthe attributes characterized in FIG. 11 can be controlled or selectedbased on parameters or sensed attributes and used real-time in feedbackto control current and/or future control parameters. Software andcoordinated machine behaviors will be controlling the monomer states andbuild area properties.

The proposed subject matter disclosed herein related to a novelhigh-speed, high-detail 3-D printing/additive-manufacturing device andassociated chemistries, can utilize the following effects and states,which control the cure of the monomer and thus the building of objects.The monomer states as defined are:

1. Build State: Voxel that starts to catalyze and joins with the nextdroplet as it extrudes from the capillary, an elliptical shape (not a“pancake”);

2. Valve state: Voxel is elliptical (not a “pancake”), but gelled (notfully catalyzed), and thus plugs or “valves” the capillary hole until itis de-valved;

3. De-valve build state: The gelled voxel is reheated to re-start thecatalytic event to complete cure, to a ready-to-connect voxel with thecontinuous upsurge of fluid;

4. Sand bed state: Voxel is not allowed to connect with the other fluid,it cures fast and releases to create a support structure en masse as asand bed. Sizing issues of granules will influence addressing andrepetition of granule creation to ensure volumetric accuracy, as theshape of these may be rounder and require a different percentage ofcured monomer to fill the volume with air between. That volumetricaspect relates to fluidic analysis, heat requirements, what shapes willby various monomer selections.

5. De-valve sand state: The gelled voxel is reheated to re-start thecatalytic event to complete cure, to a disconnected sand granule voxelwith the continuous upsurge of fluid.

It should be understood that these processes are determined by thecharacteristics of the monomer and latent heat catalyst, and theirflow/temperature dependence. Accordingly, the software and hardwareconstruction regulate flow and temperature as determined for variousgeometries, voxel shapes and sizes, and are related to specifiedgel/cure temperatures and monomer properties.

The machine has an integrally constructed platen, either of a randomlyporous flat structure such as an open celled fused microsphere orparticulate material, preferably of but not limited to, a variety ofheat resistant materials such as silicate, ceramic, PTFE, polycarbonateor of metal having a passivated insulated oxide outer layer orpreferably precisely cut flat platen consisting of parallel alignedfused micro capillaries. This platen permits the transit of liquidreactive monomers, thermoplastic or dissolved metal materials through anotherwise walled barrier between a supply reservoir and an imagebuilding section oppositely situated for the purpose of very rapidselective sequential planar voxel layer build construction of a 3D partor image.

This same machine with said platen can include at least one surface tobe covered by a Cartesian orthogonal, polar coordinate, parallel orotherwise linear cross section of electrically conductive traces whichcan be selectively addressed at said trace cross sections with biasedvoltages, which cause activating heat and/or light to selectivelyactivate monomer (polymerization, thermoplastic extrusion or inorganicmetal or mineral precipitation primarily but not limited toelectrolysis), for the purpose of very rapid selective sequential planarvoxel layer build construction of a 3D part or image.

The conductive traces may be bonded by a plurality of optional methods.Such methods may include one or more of interlayer heat fusion,organopolysiloxane functionalized adhesion, indium or any variety ofalloys specialized for the purpose affixing conducting metal to an opencelled fused microsphere or particulate material. According to someembodiments, this may include a variety of heat resistant materials suchas silicate, ceramic, PTFE, polycarbonate or of metal having apassivated insulated oxide outer layer or preferably precisely cut flatplaten consisting of parallel aligned fused micro capillaries. The microcapillaries can be provided for the transit of liquid reactive monomers,thermoplastic or dissolved metal materials through an otherwise walledbarrier between a supply reservoir and an image building sectionoppositely situated for the purpose of very rapid selective sequentialplanar voxel layer build construction of a 3D part or image.

A planar build platen can be sealed around its outer edges tohermetically seal and separate the reservoir section from the oppositebuild section surfaces. The Cartesian, orthogonal, polar coordinate,parallel or otherwise linear cross section of electrically conductivetraces which can be selectively addressed by video drivers known in theart of the display industry, including, but not limited to, systematicorderly multiplexed passive, active, optical, or VAPM electrical signals(e.g. see U.S. Patent Publication 2009/0051863 A1 to the same inventor)at said trace cross sections. This can accomplish the purpose of veryrapid selective sequential planar voxel layer build construction of a 3Dpart or image.

Auxiliary supporting machinery, which includes a precision movableZ-stage or vertically incrementally controlled planar section whichmoves away from the build platen can be included during the buildprocess. This Z-stage can pull away from and allow for increased buildvolumes to transit through the platen without weight impeding builtobject growth or tp prevent distortion. Again, the build volumes caninclude liquid reactive monomers, thermoplastic or dissolved metalmaterials.

A variety of build modes are addressable to the build platen, whichprovides a means of interfused layered voxel integument, such asdendritic or sprue supports or a plurality of multiple non interfusedyet polymerized particulates (sand bed) dispersed also as basic supportmembers for an otherwise necessary build article needing physicalsupports. Such build articles can include extended structures, which maybe horizontal or island in nature.

A build mode can also include a partially activated, but incomplete,polymerization area (valve state) that serves the purpose of blockingtransit of further material beneath it. This can essentially act as anoff-valve until it becomes necessary to finish activating thepolymerization, thus releasing from the build platen's capillarysurface.

The machine architecture may also include the acoustically live elementbut not limited to, ultrasonic piezo-, magneto-restrictive, or speakermechanism, also for the purpose of aiding in the release of successivelayers from the platen and also to enhance movement of the fluid throughthe capillaries or platen, via reduction of surface tension thereby,which also reduces required pressurization of monomer in the monomermanifold. This machine will include variously necessary removableenclosures for the successful build and removal of said build objectupon completion, and replenishment of monomers and cleaning of platens.

Various machines disclosed herein may include but not be limited to, aseries of fitted cassette and/or replaceable volume build materialcartridges for the purpose of augmented ease of operation and safetyprecautions. Said machine may include but is not limited to either anattached or an unattached sealable reservoir for finish cyclepolymerization or neutralization of otherwise reactive unusable buildmaterials for the purpose of rendering them as toxicologically benign.

Such machine disposal reservoir may also utilize a variety of newlydiscovered photo redox catalysis, such as but not limited to, nano-scaleparticulate anatase titanium dioxide and several metallic dopedvarieties of the same. These can be used to consume organic materials byreducing them in the presence of light energy, to inert gaseousbyproducts such as nitrogen, carbon dioxide and water for the purpose ofrendering them as toxicologically benign.

Various machines may be integrated with any variety of computer hardwareor computer programs designed specifically for the purpose of imagebuilding with real materials. Such machines, may be augmented by, butnot limited to, an additional optical support and focusing mechanismcapable of projecting either a physically attached or unattached visualimagery system from behind the build surface, thereby leveraging thenatural features of light guides, which are also said capillary liquiddelivery structures for the purpose of activating a photo conductiveresistive element. This photo conductive resistive element may bedeposited (or otherwise located) between the intersecting conductiveaddressing nodes which cause activating heat and/or light to selectivelyactivate monomer polymerization. This can also augment the necessaryenergy required for such polymerization voxelization build events.

Various machines disclosed herein may incorporate several additionalplatens, which are vertically or horizontally separate, but integratedphysically into the same machine.

Biologic materials such as collagen and/or suspended cellular materialsmay also be activated by the build platen including the purpose ofprosthetic use, active biocultures or non-invasive modeling studies.Such machines may also prove useful as an electrophoresis separationplatform due to the incorporated addressable voltage separationfeature/option.

Methods, computer systems, computer-storage media, and graphical userinterfaces are provided for controlling a rapid three dimensionalmodeling apparatus and method. Also methods, computer systems,computer-storage media, and graphical user interfaces are provided formanufacturing the machines, platens, and other components. Othercomputing devices are used for controlling chemistry and materials fordeposition and curing as well as sensors and/or feedback control of thecreation of the rapidly-made objects.

Embodiments of the present invention relate to systems, methods,computer storage media, and interactive graphical user interfaces (GUIs)for, among other things, displaying and interacting with performancedata for a machine-learned model.

Accordingly, in one embodiment, the present invention is directed to oneor more computer-readable media having computer-executable instructionsembodied thereon that, when executed by a computing device, cause thecomputing device to generate a graphical user interface (GUI) forvisualizing the design and manufacture of an object made using the rapidthree dimensional modeling apparatus and methods. The GUI comprises anitem representation display area that displays a plurality of itemrepresentations corresponding to a plurality of items processed by themachine-learned model.

In another embodiment, the present invention is directed to one or morecomputer-readable media having computer-executable instructions embodiedthereon that, when executed by a computing device (e.g. a servercomputer, carriage computer, needle-point printer computer, artistcomputer, article design and/or assembly computer, etc.), cause thecomputing device to perform methods, visualizations and manipulations ofdigital models and manufacturing and object manufacturing controlprocedures as disclosed herein.

An example of an operating environment in which embodiments of thepresent invention may be implemented is described below in order toprovide a general context for various aspects of the present invention.An exemplary operating environment for implementing embodiments of thepresent invention is a computing device. The computing device is but oneexample of a suitable computing environment and is not intended tosuggest any limitation as to the scope of use or functionality ofembodiments of the invention. Neither should the computing device beinterpreted as having any dependency or requirement relating to any oneor combination of components illustrated.

Embodiments of the invention may be described in the general context ofcomputer code or machine-usable instructions, including computer-usableor computer-executable instructions such as program modules, beingexecuted by a computer or other machine, such as a personal dataassistant, a smart phone, a tablet PC, or other handheld device.Generally, program modules including routines, programs, objects,components, data structures, and the like, refer to code that performsparticular tasks or implements particular abstract data types.Embodiments of the invention may be practiced in a variety of systemconfigurations, including hand-held devices, consumer electronics,general-purpose computers, more specialty computing devices, etc.Embodiments of the invention may also be practiced in distributedcomputing environments where tasks are performed by remote-processingdevices that are linked through a communications network. In adistributed computing environment, program modules may be located inboth local and remote computer storage media including memory storagedevices.

The computing device can include a bus that directly or indirectlycouples the following devices: a memory, one or more processors, one ormore presentation components, one or more input/output (I/O) ports, oneor more I/O components, and a power supply. The bus represents what maybe one or more busses (such as an address bus, data bus, or combinationthereof). One may consider a presentation component, such as a displaydevice, to be an I/O component. Also, processors have memory.Distinction is not made between such categories as “workstation,”“server,” “laptop,” “hand-held device,” etc., as all are contemplatedwithin the scope of a “computing device.”

An example of a computing device typically includes a variety ofcomputer-readable media. Computer-readable media may be any availablemedia that is accessible by the computing device and includes bothvolatile and nonvolatile media, and removable and non-removable media.Computer-readable media comprises computer storage media andcommunication media; computer storage media excludes signals per se.Computer storage media includes volatile and nonvolatile, removable andnon-removable media implemented in any method or technology for storageof information such as computer-readable instructions, data structures,program modules or other data. Computer storage media includes, but isnot limited to, RAM, ROM, EEPROM, flash memory or other memorytechnology, CD-ROM, digital versatile disks (DVD) or other optical diskstorage, magnetic cassettes, magnetic tape, magnetic disk storage orother magnetic storage devices, or any other medium which can be used tostore the desired information and which can be accessed by computingdevice. Communication media, on the other hand, embodiescomputer-readable instructions, data structures, program modules orother data in a modulated data signal such as a carrier wave or othertransport mechanism and includes any information delivery media. Theterm “modulated data signal” means a signal that has one or more of itscharacteristics set or changed in such a manner as to encode informationin the signal. By way of example, and not limitation, communicationmedia includes wired media such as a wired network or direct-wiredconnection, and wireless media such as acoustic, RF, infrared and otherwireless media. Combinations of any of the above should also be includedwithin the scope of computer-readable media.

The memory includes computer-storage media in the form of anycombination of volatile and nonvolatile memory. The memory may beremovable, non-removable, or a combination thereof. Exemplary hardwaredevices include solid-state memory, hard drives, optical-disc drives,and the like. The computing device includes one or more processors thatread data from various entities such as the memory or the I/Ocomponents. The presentation component(s) present data indications to auser or other device. Exemplary presentation components include adisplay device, speaker, printing component, vibrating component, andthe like.

The I/O ports allow the computing device to be logically coupled toother devices including the I/O components, some of which may be builtin. Illustrative components include a microphone, joystick, game pad,satellite dish, scanner, printer, wireless device, and the like.Interaction with the I/O components may be via voice, touch, gestures,keyboard, a pointing device such as a mouse, and the like.

Furthermore, although the term “server” is often used herein, it will berecognized that this term may also encompass a search service, a searchextender service, a Web browser, a cloud server, a set of one or moreprocesses distributed on one or more computers, one or more stand-alonestorage devices, a set of one or more other computing or storagedevices, a combination of one or more of the above, and the like.

A data store stored on a computer readable medium of a computing deviceis described. The data store includes control parameters disclosedherein. For example, the computer executable instructions stored on thememory can include control instructions for controlling the platen,matrix, curable material characteristics, flow characteristics, platenpositioning, releasing oscillation, platen manufacture, color control,heat control, curing light, image resolution, bitmap, vector, etc.including any aspect of the machine and process control disclosed hereinin use or manufacture or any part thereof. Modeling software andmachines are also disclosed herein that may including modeling of thevirtual object prior to manufacture, post process control, control ofmaterial refill, control of part validation and quality control. Thus,when stored as a data structure on a computer readable medium, RAM,and/or ROM the medium structure may be moved, accessed, instructionfollowed, written, rewritten, copied in its tangible form as anon-transitory replication of magnetic, optical, and other media, etc.

One skilled in the art will appreciate that, for this and otherprocesses and methods disclosed herein, the functions performed in theprocesses and methods may be implemented in differing order.Furthermore, the outlined steps and operations are only provided asexamples, and some of the steps and operations may be optional, combinedinto fewer steps and operations, or expanded into additional steps andoperations without detracting from the essence of the disclosedembodiments.

The present disclosure is not to be limited in terms of the particularembodiments described in this application, which are intended asillustrations of various aspects. Many modifications and variations canbe made without departing from its spirit and scope, as will be apparentto those skilled in the art. Functionally equivalent methods andapparatuses within the scope of the disclosure, in addition to thoseenumerated herein, will be apparent to those skilled in the art from theforegoing descriptions. Such modifications and variations are intendedto fall within the scope of the appended claims. The present disclosureis to be limited only by the terms of the appended claims, along withthe full scope of equivalents to which such claims are entitled. It isto be understood that this disclosure is not limited to particularmethods, reagents, compounds compositions or biological systems, whichcan, of course, vary. It is also to be understood that the terminologyused herein is for the purpose of describing particular embodimentsonly, and is not intended to be limiting.

With respect to the use of substantially any plural and/or singularterms herein, those having skill in the art can translate from theplural to the singular and/or from the singular to the plural as isappropriate to the context and/or application. The varioussingular/plural permutations may be expressly set forth herein for sakeof clarity.

It will be understood by those within the art that, in general, termsused herein, and especially in the appended claims (e.g., bodies of theappended claims) are generally intended as “open” terms (e.g., the term“including” should be interpreted as “including but not limited to,” theterm “having” should be interpreted as “having at least,” the term“includes” should be interpreted as “includes but is not limited to,”etc.). It will be further understood by those within the art that if aspecific number of an introduced claim recitation is intended, such anintent will be explicitly recited in the claim, and in the absence ofsuch recitation no such intent is present. For example, as an aid tounderstanding, the following appended claims may contain usage of theintroductory phrases “at least one” and “one or more” to introduce claimrecitations. However, the use of such phrases should not be construed toimply that the introduction of a claim recitation by the indefinitearticles “a” or “an” limits any particular claim containing suchintroduced claim recitation to embodiments containing only one suchrecitation, even when the same claim includes the introductory phrases“one or more” or “at least one” and indefinite articles such as “a” or“an” (e.g., “a” and/or “an” should be interpreted to mean “at least one”or “one or more”); the same holds true for the use of definite articlesused to introduce claim recitations. In addition, even if a specificnumber of an introduced claim recitation is explicitly recited, thoseskilled in the art will recognize that such recitation should beinterpreted to mean at least the recited number (e.g., the barerecitation of “two recitations,” without other modifiers, means at leasttwo recitations, or two or more recitations). Furthermore, in thoseinstances where a convention analogous to “at least one of A, B, and C,etc.” is used, in general such a construction is intended in the senseone having skill in the art would understand the convention (e.g., “asystem having at least one of A, B, and C” would include but not belimited to systems that have A alone, B alone, C alone, A and Btogether, A and C together, B and C together, and/or A, B, and Ctogether, etc.). In those instances where a convention analogous to “atleast one of A, B, or C, etc.” is used, in general such a constructionis intended in the sense one having skill in the art would understandthe convention (e.g., “a system having at least one of A, B, or C” wouldinclude but not be limited to systems that have A alone, B alone, Calone, A and B together, A and C together, B and C together, and/or A,B, and C together, etc.). It will be further understood by those withinthe art that virtually any disjunctive word and/or phrase presenting twoor more alternative terms, whether in the description, claims, ordrawings, should be understood to contemplate the possibilities ofincluding one of the terms, either of the terms, or both terms. Forexample, the phrase “A or B” will be understood to include thepossibilities of “A” or “B” or “A and B.”

In addition, where features or aspects of the disclosure are describedin terms of Markush groups, those skilled in the art will recognize thatthe disclosure is also thereby described in terms of any individualmember or subgroup of members of the Markush group.

As will be understood by one skilled in the art, for any and allpurposes, such as in terms of providing a written description, allranges disclosed herein also encompass any and all possible subrangesand combinations of subranges thereof. Any listed range can be easilyrecognized as sufficiently describing and enabling the same range beingbroken down into at least equal halves, thirds, quarters, fifths,tenths, etc. As a non-limiting example, each range discussed herein canbe readily broken down into a lower third, middle third and upper third,etc. As will also be understood by one skilled in the art all languagesuch as “up to,” “at least,” and the like include the number recited andrefer to ranges which can be subsequently broken down into subranges asdiscussed above. Finally, as will be understood by one skilled in theart, a range includes each individual member. Thus, for example, a grouphaving 1-3 cells refers to groups having 1, 2, or 3 cells. Similarly, agroup having 1-5 cells refers to groups having 1, 2, 3, 4, or 5 cells,and so forth.

The subject of several embodiments of the invention disclosed herein canoffer a novel, extremely rapid, and high-resolution alternative machinedesign and material selection for three-dimensional printing. Variousembodiments of the inventions relate to machines for manufacturing anobject. Various embodiments of the inventions relate to extrusionplatens, or other platen components and combination of components.Various embodiments of the inventions relate to processes and methodsfor making, using, and partially manufacturing, as wells as controllingmachines and making objects. Several embodiments of the invention relateto computer stores. Several embodiments of the invention relate tosoftware, hardware, and other products and machines as well as themanufactured objects made by the machines and processes disclosedherein. Several embodiments relate to processes for manufacturing,making, and using the machines and/or objects in combination with otherfeatures and/or acts and steps.

From the foregoing, it will be appreciated that various embodiments ofthe present disclosure have been described herein for purposes ofillustration, and that various modifications may be made withoutdeparting from the scope and spirit of the present disclosure.Accordingly, the various embodiments disclosed herein are not intendedto be limiting, with the true scope and spirit being indicated by thefollowing claims. All references recited herein are incorporated hereinby specific reference in their entirety.

What is claimed is:
 1. A method of manufacturing an object, comprising:providing a two-dimensional array of extrusion channels through whichpressurized curable material is extruded; selectively extruding thecurable material through the two-dimensional array of extrusionchannels, selectively curing the curable material at multipleaddressable two dimensional locations of the two-dimensional array ofextrusion channels, wherein the curable material is indexed using anaddressable array, the addressable array including: a first array of Xdirection traces electrically connected by a first bus; a second arrayof Y direction traces extending perpendicular to the first array of Xdirection traces, the Y direction traces connected by a second bus,wherein intersections between the X direction traces and the Y directiontraces define addressable locations of the extruded curable material. 2.A method of manufacturing an object according to claim 1, each of the Xdirection traces being individually associated with a particularelectronic frequency and each of the Y direction traces beingindividually associated with a particular frequency, wherein eachindividual addressable location of the addressable array is individuallyaddressable by the particular X direction trace frequency and Ydirection frequency associated with an intersection of an X directiontrace and Y direction trace at that location.
 3. A method ofmanufacturing an object according to claim 1, wherein thetwo-dimensional array of extrusion channels includes a two-dimensionalarray of fused-together glass tubes through which the pressurizedcurable material is extruded.
 4. A method of manufacturing an objectaccording to claim 1, wherein the curable material is simultaneouslycured at multiple individually addressable two-dimensional locations. 5.A method of manufacturing an object according to claim 1, wherein thecurable material is only partially cured at one or more locations of theindividually addressable two-dimensional locations.
 6. A method ofmanufacturing an object according to claim 5, wherein the curablematerial is only partially cured at the one or more locations of theindividually addressable two-dimensional locations to control a state ofcure of the curable material.
 7. A method of manufacturing an objectaccording to claim 5, wherein the curable material is only partiallycured at the one or more locations of the individually addressabletwo-dimensional locations to close an aperture of curable materialextrusion corresponding to the one or more locations of the individuallyaddressable two-dimensional locations.
 8. A method of manufacturing anobject according to claim 1, further comprising controlling differentlevels of heat at multiple addressable two dimensional locations of thetwo-dimensional array of extrusion channels.
 9. A method ofmanufacturing an object according to claim 1, further comprisingcontrolling different levels of heat at different addressabletwo-dimensional locations of the two-dimensional array of extrusionchannels.
 10. A method of manufacturing an object according to claim 9,wherein the different levels of heat at different addressabletwo-dimensional locations of the two-dimensional array of extrusionchannels causes different states of cure of the curable material.
 11. Amethod of manufacturing an object according to claim 10, wherein thedifferent levels of heat at different addressable two-dimensionallocations of the two dimensional array of extrusion channels iscontrolled by a level of current applied at that location.
 12. A methodof manufacturing an object according to claim 1, further comprisingcontrolling different levels of light at different addressable twodimensional locations of the two-dimensional array of extrusionchannels.
 13. A method of manufacturing an object according to claim 12,wherein the different levels of light at different addressabletwo-dimensional locations of the two-dimensional array of extrusionchannels causes different states of cure of the curable material.
 14. Amethod of manufacturing an object according to claim 13, wherein thedifferent levels of light at different addressable two-dimensionallocations of the two dimensional array of extrusion channels iscontrolled by a level of current applied at that location.
 15. A methodof manufacturing an object according to claim 1, wherein curablematerial is selectively cured at multiple addressable two dimensionallocations of the two-dimensional array of extrusion channels using anelectronically addressable matrix energized at multiple locations tocause the curable material to at least partially cure at thesimultaneously addressed locations without movement of thetwo-dimensional array of extrusion channels.
 16. A method formanufacturing an object according to claim 1, further comprisingcontrolling a level of extrusion pressure urging the curable materialthrough the two-dimensional array of extrusion channels.
 17. A method ofmanufacturing an object according to claim 16, further comprisingapplying a different level of extrusion pressure urging the curablematerial through a first location of the two-dimensional array ofextrusion channels than a second location of the two-dimensional arrayof extrusion channels.
 18. A method of manufacturing an object,comprising: providing a two-dimensional array of extrusion channelsthrough which pressurized curable material is extruded; forming a firstlayer of the object upon a support stage including: selectivelyextruding a first layer of the curable material through thetwo-dimensional array of extrusion channels; selectively curing thefirst layer of curable material at multiple addressable two dimensionallocations of the two-dimensional array of extrusion channels to form thefirst layer of the object; moving the two-dimensional array of extrusionchannels relative to the support stage; and forming a second layer ofthe object adjacent to the first layer of the object including:selectively extruding a second layer of the curable material through thetwo-dimensional array of extrusion channels; and selectively curing thesecond layer of curable material at multiple addressable two dimensionallocations of the two-dimensional array of extrusion channels to form thesecond layer of the object.
 19. A method of manufacturing an objectaccording to claim 18, wherein heat and/or light is simultaneouslyselectively energized at multiple locations of the two-dimensional arrayof extrusion channels during formation of the first and second layers ofthe object.